Flexible circuit board materials maker Taiflex has announced that its board approved a letter of intent with E Ink Holdings to jointly develop AI high-speed transmission PTFE materials. Taiflex will supply key materials for trial production and validation at E Ink's Hsinchu and Guanyin sites, targeting the growing AI materials supply chain.

The ePaper Scenario Applications and Supply-Demand Matching Event, part of the 2026 World Conference on Innovation and Development of the Display Industry, concluded successfully in Chengdu. Four ePaper technology routes — electrophoretic, electrowetting, cholesteric and total internal reflection — shared the stage, while government and industry leaders discussed applications in education, healthcare and exhibitions.

The ePaper Scenario Application and Supply-Demand Matching Session will be held on the afternoon of November 4 in Chengdu as one of 10 industry-chain matchmaking events at the 2026 World Conference on Innovation and Development of the Display Industry. Organized by the Shanghai Yangtze River Delta ePaper Industry Technology Promotion Center, it pairs frontier ePaper technologies with city-level application scenarios.

E Ink has completed an early-stage strategic investment in NewCopper, a U.S. startup developing conductive copper inks. The deal pairs E Ink's display manufacturing expertise and roll-to-roll coating capability with NewCopper's oxidation-resistant copper ink formulation, aiming at lower-cost, more localized conductive materials for printed electronics and ePaper components.